G.Skill unveils New Heat Spreader
Larger Images in Journalist Center
G.Skill π Series Heat Spreader
Larger Images in Journalist Center
G.Skill π Series Heat Spreader
Larger Images in Journalist Center

G.Skill unveils New Heat Spreader named π Series for Mid-High Range

09-Apr-2008 20:00 UTC public
09-Apr-2008 14:00 UTC media

Taipei, Taiwan (techmessenger.com) -- G.Skill International Enterprise, a leading provider of high performance memory, today announced the new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill series heat spreader design increases the air contact surface 50% more than traditional design.

Lower Temperature = Lower Power Consumption

All users are pursuing higher system performance. Memory frequency is one of the key factors. According to the theory, higher memory frequency takes higher power consumption as the higher Vdimm needed. G.Skill series heat spreader design takes more heat out from the memory IC surface. It can lower the temperature at least 20% to 30% more than the traditional design.

Lower Temperature = More System Performance

For Overclockers, every degree is also the matter. As per semiconductor characteristic, too high temperature will limit the working frequency, OC capability, and product life. G.Skill series heat spreader design allows overclockers to squeeze their memory performance more than the past. For the serious gamers, they can avoid be killed dues to the system lag.

G.Skill series product list

Model Name: Specification

F2-6400CL4D-2GBPI: DDR2-800 4-4-4-12 1GBx2 kit

F2-8000CL5D-2GBPI: DDR2-1000 5-5-5-15 1GBx2 kit

F2-8500CL5D-2GBPI: DDR2-1066 5-5-5-15 1GBx2 kit

F2-6400CL5D-4GBPI: DDR2-800 5-5-5-15 2GBx2 kit

F2-6400CL4D-4GBPI: DDR2-800 4-4-4-12 2GBx2 kit

F2-8000CL5D-4GBPI: DDR2-1000 5-5-5-15 2GBx2 kit

F2-8500CL5D-4GBPI: DDR2-1066 5-5-5-15 2GBx2 kit

F3-10600CL8D-2GBPI: DDR3-1333 8-8-8-21 1GBx2 kit

F3-10600CL8D-4GBPI: DDR3-1333 8-8-8-21 2GBx2 kit

F3-10600CL7D-2GBPI: DDR3-1333 7-7-7-18 1GBx2 kit

F3-10600CL7D-4GBPI: DDR3-1333 7-7-7-18 2GBx2 kit

F3-12800CL7D-2GBPI: DDR3-1600 7-7-7-18 1GBx2 kit

F3-12800CL7D-4GBPI: DDR3-1600 7-7-7-18 2GBx2 kit


This module will be available through G.Skill’s authorized resellers and distributors worldwide. For more information and specifications on the new HZ series products, please visit the "Product" section.


About G.Skill

Established in 1989, G.Skill is a leading memory manufacturer based in Taipei, Taiwan.

The company’s top priority is quality. All our products are put through a series of the most rigorous and strict quality control process. In addition to commissioning qualified IC testing house to test its products, all products are 100% tested to ensure the highest products yield and quality. For more information regarding the company, please visit www.gskill.com

Press Release Detail

Company Name : G.Skill International Enterprise


AddThis Social Bookmark Button  



Latest Press Releases
Related Press Releases
Home     |     Contact Us     |     Privacy Statement     |     Terms of Use © 2007 Zakx. All rights reserved.